The Dieline Conferences

We constantly get emails telling us how The Dieline serves as a main dose of inspiration to our readers everyday. We decided to bring the fundamentals of The Dieline and those sentiments to create conferences that inspire, educate, and bring package designers together. The Dieline conferences are carefully curated to offer world-class speakers, epic content, and to be -most of all - fun! 

The Dieline Package Design Conference: A multi-day conference, focusing on the package design industry and its practitioners. Our flagship conference brought close to 900 attendees in first year! Needless to say, The Dieline Package Design Conference is our biggest event of the year.

The Dieline Forum: Specifically designed to cater to a smaller audience, The Dieline Forum will address the concerns of working professionals in the package design industry in a specific regional area. The Dieline Forum is comprised of shorter and direct sessions - with the intended goal being - efficient information."

Next Conference: 


The Dieline Package Design Conference, Boston 2012
The Dieline Package Design Conference 2012 will be held on June 22nd to the 25th as a part of HOW Design Live 2012. 
Step outside the box at this inspiring, targeted event that solves the particular challenges you encounter as a packaging designer—and reveals the opportunities that arise when you know where to look. Innovation and reinvention are the watchwords at this event that will have you rethinking your assumptions about package design.
More Details at HOWDesignLive.com

Interested in Exhibiting or Sponsoring The Dieline Conference 2012? 
Please email elaynerecupero@gmail.com for more information.

Past Conferences:


The Dieline Forum, San Francisco 2011

The Dieline Package Design Conference, Chicago 2011