Call for Speakers: Packaging & Branding at HOW Design Live 2016

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Over the past 5 years, The Dieline has had the pleasure of collaborating with some of the greatest minds and most talented designers and leaders in the design industry through The Dieline Packaging & Branding at HOW Design Live.

Are you interested in speaking for us? We want to hear from you!

The Dieline Packaging & Branding Conference at HOW Design Live Atlanta, May 19-23

Potential Topics: Packaging Design, Branding, Structural Design, Consumer Brands, Consumer Product Branding, Consumer Trends, Packaging Materials & Substrates, Best Practices, The Future of Package Design.

SUBMIT HERE

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