The Dieline Summit: Early Booking Rate Extended & New Group Rates Available
Come join us this November 16 & 17 in Paris for The Dieline Summit.
We've officially extended our early booking rate. There is still time to book at the special rate of 980 €. Includes TAX/VAT
The Dieline Summit at Emballage includes:
• Cocktail Reception, Hosted Lunch, Coffee Breaks
• Transport to Emballage - World's largest packaging expo.
• Free entry to the Emballage 2014 International exhibition (November 17 - 20)
• A networking event on Sunday November 16th hosted by Keynote Speaker Rebecca Costa.
• 1-Year Subscription to PantoneView.com when you register.
Interested in bringing the team? Bring four or more people and get a group discount of 30%.
623 € per ticket. Not including VAT/TAX.
7 DESIGN LEADERS. 1 SIMPLE QUESTION:
WHAT IS THE FUTURE OF PACKAGING?
The Dieline Summit talks will focus on the future of packaging. The Summit and our speakers are setting out to create a different kind of package design conference: A future-forward discussion that challenges the status-quo, and inspires creators of packaging and products to help solve today’s global problems and change the world through package design. The overall mission our speakers will be discussing is:
What is the Future of Packaging?
Our schedule for the Dieline Summit starts the evening of November 16th with our opening keynote speaker Rebecca Costa at The Hyatt Regency Paris Etoile overlooking the city lights on the 34th floor at Bar La Vue. November 17th will be a full day of sessions from our design leaders and will end with a panel discussion presented by Rebecca Costa.
Join us on November 18th to visit and explore the largest packaging expo Emballage.