Win a Pass to The Dieline Package Design Conference!
Last Monday, we launched the Papercraft Challenge!
Elevate Your Profile as a Package Design Talent Via The Dieline Conference Papercraft Challenge 2013 - One designer will win a free registration for The Dieline Package Design Conference!
Your creativity could win you a free pass to The Dieline Package Design Conference 2013 in San Francisco this June. The Dieline Conference Papercraft Challenge 2013 is a pure design challenge where designers can showcase their package design skills by transforming blank three-dimensional letters or icons with customized art. Projects submitted by the finalists and winner will be featured on TheDieline.com and on screen at The Dieline Package Design Conference held in conjunction with HOW Design Live at the Moscone Center in San Francisco June 22-26, 2013.
Deadline for entry is May 15, 2013. For complete details on this The Dieline Papercraft Challenge click here.
Help us spread the word!
Download this PDF poster design, and join the conversation on Twitter at @TheDieline using hashtag #DLPC13.