Announcing: The Dieline Package Design Conference 2013!

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I am beyond thrilled to officially announce The Dieline Package Design Conference 2013! As a part of HOW Design Live, The Dieline Package Design Conference will take place June 23-26 in San Francisco, CA.

We have put together an incredible lineup of speakers, with a over 20 inspiring sessions this year all centering around the theme of ELEVATE.

The event will be dual-keynoted by Cheryl Swanson, Co-founder of Toniq, and Steve Kazanjian, VP of Global Creative of MWV!

Some of our speakers include:

Joseph Duffy IV, Design Director: Duffy & Partners

Jeff Loth, Global Packaging Manager: Microsoft

Terri Goldstein, Principal and Founder: The Goldstein Group

Kevin Shaw, Founder: Stranger & Stranger

David Turner, Principal and Co-Founder: Turner Duckworth

Aaron Keller, CEO: Capsule

Hamish Campbell, Creative Director: Pearlfisher


The ELEVATE Theme:

Brand strategies are now being built from the package outward – but a major shift happening now is towards the packaging architecting all brand touch points. Brands, and designers are beginning to understand the value of starting with the package first.

The Dieline Package Design Conference 2013 will show package designers how to extend the perception of their expertise and how to vocalize and be more articulate about what their design means to their brand.

We want to teach package designers to be better at considering the role of design in improving sales of a product, and to create meaningful differentiation. There are lots of beautiful designs out there, but not many are reinventing the perceptions of product benefits or paying off on shifting, emerging cultural ideology. We would like to change that.

We will give package designers the language and tools to convince higher ups that their design is truly communicating to the brand target. We will elevate the role of package designers beyond craftsmanship discussions, and have more talks about becoming more influential and in demand, and how to become industry leaders.

The Dieline Package Design Conference 2013 will take a larger role of elevating the role of the package design and the package designer.

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