Call For Speakers & Save The Date: The Dieline Package Design Conference San Francisco
Brand strategies are now being built from the package outward – but a major shift happening now is towards the package design architecting all brand touch points based on the brand expression centering in the package design.
Brands, and designers are beginning to understand the value of starting with the package first. The Dieline Package Design Conference 2013 will show package designers how to extend the perception of their expertise and how to vocalize and be more articulate about what their design means to their brand.
We want to teach package designers to be better at considering the role of design in improving sales of a product, and to create meaningful differentiation. There are lots of beautiful designs out there, but not many are reinventing the perceptions of product benefits or paying off on shifting, emerging cultural ideology. We would like to change that.
The Dieline Package Design Conference 2013 will give package designers the language and tools to convince higher ups that their design is truly communicating to the brand target. We will elevate the role of package designers beyond craftsmanship discussions, and have more talks about becoming more influential and in demand, and how to become industry leaders.
Our goal is to go beyond presentations about geeking out on typography or what colors are in this year; The Dieline Conference 2013 will take a larger role of elevating the role of the package design and the package designer.
Interested in speaking at, sponsoring, exhibiting, or have questions about The Dieline Package Design Conference 2013?
Please contact Andrew Gibbs for more information at firstname.lastname@example.org.
The Dieline Package Design Conference will take place on June 23-26 in San Francisco, CA.