The Dieline Forum: Los Angeles was a smashing success! A big thank you to everyone who joined us, we hope you had a truly amazing, thought-provoking experience.
As The Dieline has grown over the years, being able to put on these events for the package design community has truly become an honor for us. We hope you will join us for our next event, The Dieline Package Design Conference 2013 at HOW Design Live 2013 in San Francisco, June 22nd - 26th. Join our email newsletter for further details as they are announced.
Check out our Facebook Photo Gallery from the event.
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Special thank you to our incredible sponors who made this event possible:
Interested in sponsoring or partnering with The Dieline for a future event? Email firstname.lastname@example.org for more info.