The Dieline Package Design Conference - Boston!
We are excited to announce that The Dieline Package Design Conference is back for 2012!
This year we head to Boston! A major American epicenter of knowledge, history, and revolution.
We spent a lot of time putting this second conference together, so we hope you find it as inspring as we have. The site is now live, so go ahead and take a look!
Also, tomorrow we will be giving out a special Dieline-only conference code worth $230 off the Early Bird individual full-conference rate good through January 31st.
The only way to get it though, is by signing up for our newsletter here. If you're already subscribed - you needn't worry.
Join The Revolution.
The Dieline Package Design Conference: A multi-day conference, focusing on the package design industry and its practitioners. Our flagship conference brought close to 900 attendees in its first year, so we are beyond thrilled to announce that we are back for our 2nd annual conference in Boston!
Join expert package design innovators at this inspiring, information-packed event addressing the specific challenges and opportunities unique to packaging designers. You'll discover new ways to do great work on a tight budget, reinvent your brand, create meaningful design, and delve into the mind of the consumer with help from Dan Formosa, Debbie Millman, Wally Olins and more.
Finally, you'll get to connect with hundreds of other packaging designers to cross-pollinate ideas, network, and make valuable connections.
Don't miss out - see you in Boston!