See who is attending The Dieline Package Design Conference

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The first ever The Dieline Package Design conference is a short six and a half weeks away! We are working hard behind the scenes to bring you a package design conference like you have never seen, and an incredible awards show to honor this year's best.

We have already received hundreds and hundreds of registrations from around the world, more than we ever expected, making The Dieline Package Design Conference, Awards, and Expo the biggest package design event of the year.

Register now before we sell out!

Who will be attending? A list of just some of the companies who will be in attendance after the jump.

 

Abercrombie & Fitch Landor Associates
Allen Field Co. LasX Industries, Inc.
Anheuser-Busch LAUNCH
Avery Dennison LBS
Bacardi Louise Fili, Ltd.
Beardwood&Co Michael Osborne Design, Inc
Biggs&Co MSI Global
Brandever Nestle USA, INC
Brandimage New Belgium Brewing Company
Brandimation NueSku
Campbell Soup Company Oce North America
CAPSULE Osram Sylvania Inc
CBX Pearlfisher
CheckMark Communications PhilippeBecker
Ciulla Assoc Pilot Flying J
Cornerstone Strategic Branding Pixology
Costco Wholesale Product Ventures
Creature Product Ventures
Design House Quality Assured
Design North Roland DGA Corporation
Deutsch Design Works Seattle's Best Coffee
Discover Soulsight
Disney Theme Park Merchansise Speck Products
Duffy & Partners Starbucks
Elmwood Design Sterling Brands
Georgia-Pacific Taylor Box
Gravitytank Tether
Grupo Oxigeno Tetra Pak
Hallmark Cards The Hershey Company
Hansen Beverages The Marketing Store
Hasbro, Inc The Republic of Tea
Henkel Corporation The Saltmine
Interact Packaging The Shear Partnership
Interbrand Trader Joe's
Inwork, Inc Turner Duckworth
iostudio Utopia
Johnson & Johnson Vivabox USA
Kimberly-Clark Wallace Church Inc.
Kraft Foods Webb deVlam
LabelOne Connect, Inc. Yupo Corporation America

We hope to see you in Chicago!

 

- The Dieline


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