The extended Early Bird Discount Deadline for The Dieline Package Design Conference is coming up on May 1st, giving you $180 off the individual full-conference rate!
You’ll learn directly from the most innovative and well-known names in package design: Michael Osborne, Joe Duffy, Mike Peck of Starbucks, David Turner and Bruce Duckworth of Turner Duckworth, Louise Fili, Christine Mau of Kimberly-Clark Worldwide, and many more.
You’ll share ideas with other package designers from across the country at networking events like a Conference Happy Hour and Breakfast Roundtables, plus The Dieline Awards Ceremony, featuring 39 winners selected across 13 categories. Winning entries will also be displayed at The Dieline Conference, guaranteed to inspire.
And your registration fee also covers admission to The Dieline EXPO (a $25 value), featuring the newest products and services exclusively for package designers.
Don’t wait— Conference spots and hotel rooms are filling up fast.
