The Dieline Awards 2011

The Dieline Awards 2011 gets even better! The second annual The Dieline Awards will be presented as the headline event of the first annual The Dieline Package Design Conference, at HOW Design Live in Chigago on June 24th, 2011. 

Mark your calendars and get your designs ready, entries will be accepted beginning on Jan 4th to Feb 1st! More details coming soon.

In 2009 The Dieline launched the first annual The Dieline Awards, a worldwide package design competition devoted exclusively to the art of brand packaging. With over 800 entries into the competition, The Dieline Awards instantly became the nation’s leading package design competition. 31 world-class package designs were awarded in early 2010.

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